CLP 7106 / CLI 4010

Flexible polyurethane system for potting and casting in electrical applications. A two component, low viscosity, low durometer, polyurethane potting compound. The cured material meets the requirements of UL94-V0. CLP 7106 / CLI 4010

CLP 7330 / CLI 4161

Economical, flexible, potting and casting polyurethane system. a solventless, low viscosity, flexible, two component polyurethane casting resin. CLP 7330 / CLI 4161

CLR 1020 / CLH 6021

Semi-flexible epoxy adhesive and casting system. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1020 / CLH 6021

CLR 1026 / CLH 6021

Low viscosity, semi-flexible. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1026 / CLH 6021

CLR 1946 / CLH 6500

Product is recommended for potting and encapsulating applications. A two component, room temperature cure semi-flexible epoxy system. The system was developed for potting / casting of electrical and electronic components. Its use of non abrasive fillers and convenient 1:1 ratio by volume, makes it ideal for use in machine dispensing equipment. CLR 1946 / CLH 6500

CLR 3507 / CLH 6230

A semi-flexible, 100% solid, epoxy system. This product was specifically developed for potting / casting of electrical and electronic components. The long pot life of the material makes it suitable for large mass castings or heat induced curing with minimal stress. Product passes UL94-HB in-house flammability testing. For a more rigid system, CLR 3517 / CLH 6230 is recommended. CLR 3507 / CLH 6230

XID 1681 / XHD 1652

A two component polyurethane casting system. Product has long pot-life and cures to a hardness of 65 Shore D. XID 1681 / XHD 1652

XPD 1401 / CLI 4182

Density = 0.80. A low viscosity, low density, user-friendly, room temperature cure, MDI based polyurethane system. The product cures to a hardness of 60 shore A, and has a cured density of 0.80 gms/cm3. XPD 1401 / CLI 4182

XRD 1018 / XHD 1019

1:1 Mix Ratio, 130°C Operating, General Purpose, Low cost. A two component, room temperature cure semi-flexible, flame retardant, epoxy system. The system was developed for potting/casting of electrical and electronic components. Its use of non-abrasive fillers and convenient 1 to 1 ratio by volume, make it ideal for use in machine dispensing equipment. This product meets UL94-V0 in house flammability testing. XRD 1018 / XHD 1019

XRD 1347 / XHD 1348

The product cures to a shore hardness of 50 A, low viscosity, soft system. A two component, very flexible epoxy system. XRD 1347 / XHD 1348

XRD 1501 / CLH 6090

4:1 Ratio, soft system. A two component unfilled, flexible epoxy system. Product features low viscosity, long pot life and cures to a shore hardness of 70A. XRD 1501 / CLH 6090